Electronics & Telecom

SMC and BMC molding resins, combined with low-shrinkage additives and carrier resins, are mainly used in inverter housings, communication cabinets, electrical junction boxes, and various insulating structural parts. The molding shrinkage of the products is controllable, ensuring high dimensional accuracy and reliable insulation performance, capable of withstanding alternating high and low temperature outdoor conditions. Compatible with automated compression molding lines, they are suitable for mass production of components and meet the stringent product standards of the electronics, electrical, and telecommunications industries.